SEMICON Taiwan International Semiconductor Exhibition is coming to an end, with both the scale of exhibitions and the number of visitors reaching record highs. Industry experts said that the focus of this year's semiconductor exhibition is heterogeneous integration and silicon photons, and it is expected to be the trend of semiconductor industry development.
According to the International Semiconductor Industry Association (SEMI) statistics, SEMICON Taiwan, held from September 10 to September 12, has come from 65 countries and more than 1,200 companies, using more than 4,100 positions, and 17 national museums, attracting 100,000 people to participate. The scale of exhibitions and number of visitors reached an all-time high.
SEMI pointed out that SEMICON Taiwan is expected to be held next year from September 2 to September 4, 2026. According to preliminary estimates, the current exhibition rate of exhibitors will reach 95% next year, and the expected exhibition scale will be expected to reach a new high next year.
Liu Peizhen, president of the Taiwan Institute of Industry Database, said that this year's semiconductor exhibition mainly covers the innovation and industrial chain integration of semiconductor technology under the driving force of artificial intelligence (AI). From advanced process, packaging technology to intelligent manufacturing, and then to talent cultivation, it shows Taiwan's full position in the global semiconductor industry, and draws future blue pictures for the industry's biological system.
Liu Peizhen said that heterogeneous integration is one of the key points of the semiconductor development. In order to create stronger and more capable AI chips, chips with different processes and functions, such as logic, memory and sensors, are integrated into a single package, becoming the goal of the semiconductor industry's efforts.
Liu Peizhen pointed out that traditional electrical signal transmission has been difficult to meet the large data throughput needs of AI, and silicon photonics will be the key technology that breaks through data transmission bottlenecks. Extraordinary integration and silicon photons will become the core strategy of semiconductor industry under AI drive. Taiwan has leading advantages in advanced processing and packaging, and will continue to play a very important role.
Analyst Wang Zhaoli said that semiconductor exhibition is a semi-conductor technology trend, and observing equipment such as abnormal quality integration is the focus of Taiwan's display. Different quality integration allows chips with different processes, materials and functions in a single package, and is the key to accelerating the realization of system-level innovation.
Wang Zhaoli said that silicon photons and co-packaging optics (CPO) are key to data transmission breakthroughs. As the AI model scale expands, the demand for high-speed optical communications has grown rapidly, and its importance has continued to increase.