ERS electronic, a semiconductor equipment manufacturer and industry leader in temperature control solutions, demonstrated its latest technology at the Semicon Taiwan 2025 exhibition today (9th), with the goal of solving key challenges such as crystallographic detection, advanced packaging and tuning adjustment.
"Taiwan is the core point of advanced packaging!" ERS executive director Laurent Giai-Miniet pointed out that the Taiwan market contribution ERS company will receive a total of 33% in 2024, and it is expected to increase to 48% this year. Looking ahead to 2030, Giai-Miniet expects global revenue to increase to 2 times, and expects that the Taiwan market will pay half of the company's revenue. At the same time, it will also deepen its roots in Taiwan, such as promoting the Taiwan team, promoting practical plans, providing opportunities for Taiwanese students to participate, and cooperating with universities and research institutions in Taiwan.
In the technical part, with AI, HPC, HBM and panel packaging (PLP) becoming the focus of the industry, the chips are getting bigger and thinner. ERS believes that they bring two major challenges: high-power heat dissipation (Thermal Management) and Warpage Control, especially the latter is prone to deformity in large-size, ultra-thin crystal circles and panels, which will directly affect yield.
Therefore, ERS has launched a series of advanced solutions to meet the needs of rapid semiconductor industry evolution. For example, the Thermal Chuck Systems temperature-controlled card system for wafer testing has high power dissipation capabilities (up to 2.5kW), which can be used to test high-performance devices such as AI accelerators, GPUs, and DRAM/NAND.
Another tumbling adjustment solution combines a patented non-contact wafer/panel transmission system and tumbling correction technology, and is paired with a 3D tumbling quantity measurement tool Wave3000, which is suitable for the shape control and quality verification of multi-layer structures of wafer and panel packaging.
As for traditional laser debonding, which can easily cause local overheat and material damage, ERS has launched the LumosON optical slurry machine, which is the leading temporary bonding and slurry (TBDB) solution in the industry, is suitable for ultra-thin round and panel packaging (PLP) processes, and supports fan-out packaging (Fan-out), HBM and CoWoS and other different integrated packaging technologies.
"ERS has been deeply engaged in the field of temperature control and crystalline testing for 55 years. We can often complete tasks that others do not want to take on." Giai-Miniet believes that this is also one of the company's advantages; ERS Taiwan General Manager Sébastien Perino pointed out that traditional laser deflection brings high costs and material risks, while ERS's optical deflection energy is more uniform and the process is gentler, so we can truly invest in quantity; Evelyn Weng, Marketing Manager of Advanced Packaging Equipment Products It is emphasized that many companies can measure syringes, but only ERS can measure at the same time, correct them immediately and repair the crystal circle at the production site.
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